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Genesis Enterprise™

Extensible software combines parametric, defect and memory yield optimization in one unified platform with data mining and workflow development across all data sources.

The Genesis Enterprise™ Yield Maximization Platform is the cumulative result of yield management experience gained from customers such as world leading microprocessor and memory manufacturers, foundries, and fabless producers.  Through these established customer relationships as well as close partnerships with leading universities, Genesis has proven to be the most advanced technological platform for yield maximization for customers who require the most advanced enterprise level yield management.

Through its patented Yield Mine® automated decision making technology, Genesis has reduced the analysis time to find root causes of yield excursions in their leading edge production line by a factor of five, according to the world's foremost semiconductor foundry.

As the industry’s only true enterprise platform, data may be imported seamlessly from any data source, whether parametric, defect, memory, design, or assembly and packaging.  The Yield Base® and Metadata™ data management and connectivity infrastructure assures reliable integration into the Genesis analysis and reporting platform.

Genesis enables customers with a complete yield management enterprise platform that includes data acquisition and integration, data analysis, automated decision making through data mining, a development environment through work flow and scripting, and specialized analysis algorithms to identify and correct spatial anomalies, wafer processing sequence problems, commonality of effects, detection of outliers and trends, and yield modeling to assess the impact of the design on the "manufacturability" of the resulting chip.

The Genesis Enterprise™ platform includes the following components:

Click on any header to see product screenshot examples

Infrastructure Core

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Yield Base® enterprise database with schema

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Enterprise Metadata™ manager

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Inter-operability framework (defect/parametric/bin/bitmap)

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Automation software

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Database utilities suite (restore, browser, archive, de-archive)

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Data sources management software (reader/writers and data loaders)

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Flextract® data integration development platform

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Pre-configured extraction GUI's

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Custom extraction GUI editor

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Enterprise replication manager

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Scripting engine runtime license manager

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License manager software

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Data normalization infrastructure

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Permissions management

Viewers

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Genesis Explorer

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Wafer Map Viewer

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Bitmap Viewer

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Defect Viewer

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Image Viewer

Parametric Analysis

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Parametric Charts (Box-Whisker, Histogram, Pareto, Pie, Q-Q, SPC, Trend, X-Y, X-Y-Z, etc.)

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Parametric Reports (Extremities, Summary Reports, Tabulation Reports, Web Reporting, etc.)

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Product Characterization Analysis (Guard Band, Marginal Parameters, Shmoo, Two-Condition Analysis)

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Repeating Bin Analysis (Die, Wafer, Reticle)

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Repeating Parametric Analysis

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Parametric Zonal Analysis

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Parametric Wafer Positional Analysis

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Systematic/Random/Reticle Yield Analysis

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Bin and Parametric Spatial Signature Analysis

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Commonality Analysis

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Cyclical Trend Analysis

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Equipment and Equipment Group Studies

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Parametric Outlier Analysis

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Shift Analysis

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Split-Lot Analysis

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Parametric Reliability Analysis

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Yield Modeling Analysis (Extract Yield Components, Predict Yield for New Product, Yield Forecasting, etc.)

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Parametric Sensitivity Analysis

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WET to Sort Analysis

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Tool Usage Analysis

Defect Analysis

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Defect Charts

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Defect Reports

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Adder/Repeater/Clustering Analysis

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Defect Limited Yield Calculation

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Repeating Defect Analysis (Die, Wafer, Reticle)

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Defect Yield Predictor and Modeling

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Defect Layer Sensitivity Analysis

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Commonality Analysis

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Split-Lot Analysis

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Bin to Defect Correlation

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Kill Ratio Analysis

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Defect Sampling Analysis (Size, Count, Radius, etc.)

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Defect Wafer Positional Analysis

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Defect Cyclical Analysis

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Defect Zonal Analysis

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Defect Spatial Signature Analysis

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Defect Shape Classification

Memory Analysis

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Bitmap Classifier and Signature Editor

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Bitmap Charts

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Bitmap Reports

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Defect to Bitmap Correlation

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Signature to Defect Correlation

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Kill Ratio Analysis

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Repeating Signature Analysis (Die, Wafer, Reticle)

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Repeating Bit Analysis (Die, Wafer, Reticle)

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Matched Failures Defect Limited Yield Analysis

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Bitmap Zonal Analysis

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Bitmap Electrical Defect Density

Statistical Analysis

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Basic statistics

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ANOVA

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MANOVA

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Kruskal-Wallis Non-Parametric ANOVA

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Principal Components

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Correlation Analysis

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Regression (linear and multiple)

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Two-Sample Comparison

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Design of Experiments

Data Mining

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Yield Mine® patented decision-tree analysis

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Yield Map™ neural network self-organizing map analysis

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Spatial Signature Analysis (wafer classification, tests of spatial randomness, and spatial interpolation)

Development Platform Tools

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Workflow™ Development Platform

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Workflow API

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Scripting Engine

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Scripting Recorder

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Scripting API

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