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Genesis
Enterprise™
Genesis
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Genesis
FPD™
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Genesis Enterprise™
Extensible
software combines parametric, defect and memory yield optimization in one
unified platform with data mining and workflow development across all
data sources.
The Genesis
Enterprise™ Yield Maximization Platform is the cumulative result of
yield management experience gained from customers such as world leading microprocessor
and memory manufacturers, foundries, and fabless producers.
Through these established customer relationships as well as close
partnerships with leading universities, Genesis has proven to be the most
advanced technological platform for yield maximization for customers who
require the most advanced enterprise level yield management.
Through its
patented Yield Mine® automated
decision making technology, Genesis has reduced the analysis time
to find root causes of yield excursions in their leading edge production
line by a factor of five, according to the world's foremost semiconductor
foundry.
As the
industry’s only true enterprise platform, data may be imported
seamlessly from any data source, whether parametric, defect, memory,
design, or assembly and packaging. The Yield Base® and Metadata™
data management and connectivity infrastructure assures reliable
integration into the Genesis analysis and reporting platform.
Genesis™
enables customers with a complete yield management enterprise platform
that includes data acquisition and integration, data analysis, automated
decision making through data mining, a development environment through
work flow and scripting, and specialized analysis algorithms to identify
and correct spatial anomalies, wafer processing sequence problems,
commonality of effects, detection of outliers and trends, and yield
modeling to assess the impact of the design on the
"manufacturability" of the resulting chip.
The
Genesis Enterprise™ platform includes the following components:
Click
on any header to see product screenshot examples
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Yield
Base®
enterprise database with schema |
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Enterprise
Metadata™ manager |
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Inter-operability
framework (defect/parametric/bin/bitmap) |
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Automation
software |
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Database
utilities suite (restore, browser, archive, de-archive) |
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Data
sources management software (reader/writers and data loaders) |
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Flextract®
data integration development platform |
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Pre-configured
extraction GUI's |
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Custom
extraction GUI editor |
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Enterprise
replication manager |
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Scripting
engine runtime license manager |
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License
manager software |
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Data
normalization infrastructure |
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Permissions
management |
Viewers
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Genesis Explorer |
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Wafer Map Viewer |
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Bitmap Viewer |
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Defect Viewer |
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Image Viewer |
Parametric
Analysis
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Parametric Charts (Box-Whisker, Histogram, Pareto,
Pie, Q-Q, SPC, Trend, X-Y, X-Y-Z, etc.) |
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Parametric Reports (Extremities, Summary Reports,
Tabulation Reports, Web Reporting, etc.) |
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Product Characterization Analysis (Guard Band,
Marginal Parameters, Shmoo, Two-Condition Analysis) |
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Repeating Bin Analysis (Die, Wafer, Reticle) |
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Repeating Parametric Analysis |
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Parametric Zonal Analysis |
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Parametric Wafer Positional Analysis |
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Systematic/Random/Reticle Yield Analysis |
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Bin and Parametric Spatial Signature Analysis |
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Commonality Analysis |
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Cyclical Trend Analysis |
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Equipment and Equipment Group Studies |
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Parametric Outlier Analysis |
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Shift Analysis |
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Split-Lot Analysis |
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Parametric Reliability Analysis |
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Yield Modeling Analysis (Extract Yield Components,
Predict Yield for New Product, Yield Forecasting, etc.) |
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Parametric Sensitivity Analysis |
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WET to Sort Analysis |
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Tool Usage Analysis |
Defect
Analysis
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Defect Charts |
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Defect Reports |
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Adder/Repeater/Clustering Analysis |
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Defect Limited Yield Calculation |
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Repeating Defect Analysis (Die, Wafer, Reticle) |
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Defect Yield Predictor and Modeling |
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Defect Layer Sensitivity Analysis |
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Commonality Analysis |
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Split-Lot Analysis |
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Bin to Defect Correlation |
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Kill Ratio Analysis |
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Defect Sampling Analysis (Size, Count, Radius, etc.) |
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Defect Wafer Positional Analysis |
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Defect Cyclical Analysis |
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Defect Zonal Analysis |
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Defect Spatial Signature Analysis |
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Defect Shape Classification |
Memory
Analysis
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Bitmap Classifier and Signature Editor |
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Bitmap Charts |
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Bitmap Reports |
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Defect to Bitmap Correlation |
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Signature to Defect Correlation |
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Kill Ratio Analysis |
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Repeating Signature Analysis (Die, Wafer, Reticle) |
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Repeating Bit Analysis (Die, Wafer, Reticle) |
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Matched Failures Defect Limited Yield Analysis |
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Bitmap Zonal Analysis |
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Bitmap Electrical Defect Density |
Statistical
Analysis
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Basic statistics |
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ANOVA |
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MANOVA |
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Kruskal-Wallis Non-Parametric ANOVA |
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Principal Components |
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Correlation Analysis |
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Regression (linear and multiple) |
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Two-Sample Comparison |
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Design of Experiments |
Data
Mining
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Yield Mine® patented decision-tree analysis |
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Yield Map™ neural network self-organizing map
analysis |
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Spatial Signature Analysis (wafer classification,
tests of spatial randomness, and spatial interpolation) |
Development
Platform Tools
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Workflow™ Development Platform |
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Workflow API |
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Scripting Engine |
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Scripting Recorder |
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Scripting API |

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